1) Photomicroetching of GaSb
锑化镓的光助微刻蚀
2) Photoassisted microetching
光助微刻蚀
3) Laser assisted chemical etching
激光辅助化学刻蚀
1.
The laser assisted chemical etching was proposed to apply in the etching of YBCO high temperature superconductor(HTS)film,which was a significant application involving superconductor electronics,laser technique and chemistry.
提出了将激光辅助化学刻蚀技术应用于钇钡铜氧(YBCO)高温超导薄膜的刻蚀,研究了无掩膜YBCO薄膜激光化学刻蚀的表面特性及其变化规律,为YBCO激光化学刻蚀技术中图形形状控制、刻蚀时间选择和激光功率调节等提供了重要的实验结论。
2.
The laser assisted chemical etching was proposed to apply in the etching of YBCO high temperature superconductor film.
提出了将激光辅助化学刻蚀技术应用于钇钡铜氧(YBCO)高温超导薄膜的刻蚀,研究了无掩膜YBCO薄膜激光化学刻蚀的表面特性及其变化规律,在激光辐照下,YBCO薄膜的液相刻蚀速率大大加快,并且在整个过程中,刻蚀速率呈现加快趋势,这一特性将有可能用于改善YBCO刻蚀中的横向钻蚀情况,并提高图形边缘的侧壁陡峭度。
4) PAECE
光辅助电化学刻蚀法
1.
The main four fabrication techniques, namely laser drilling, wet etching, DRIE (deep reactive ion etching) and PAECE (photo assisted electro-chemical etching), are described in detail from the several aspects of principle, process, advantages and disadvantages.
介绍了硅基片微型通孔的用途及在微机电系统发展中的重要性,从原理、过程、优缺点等方面详细叙述了激光打孔法、湿法刻蚀法、深度反应离子刻蚀法(DRIE)和光辅助电化学刻蚀法(PAECE)等四种硅基片微型通孔的加工方法,并对各种方法进行了比较,提出了各种方法的适用范围。
6) photochemical etching
光化蚀刻
1.
With the continuousgrowth of electronic technology, photochemical etching tech-nology has expanded into many new application fields and aproduction scale is formed.
介绍了光化蚀刻的由来和传统工艺流程中五种掩膜的制作方法及四种现代的光化蚀刻法流程及其应用范围。
补充资料：水泵气蚀(见空化与空蚀)
水泵气蚀(见空化与空蚀)
shuibeng qishi水泵气蚀见空化与空蚀。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条